ASML and TSMC sign agreement to develop 12-inch photomasks by 2031

ASML Holding and Taiwan Semiconductor Manufacturing Company (TSMC) signed an agreement on September 8, 2026, to develop high-format photomasks used in semiconductor production. The two entities agreed to focus on 12-inch masks as part of a broader shift toward larger Extreme Ultraviolet (EUV) lithography tools. TSMC stated this collaboration will help reduce chip manufacturing costs while increasing productivity and removing overlay stitching constraints. ASML's high numerical aperture (NA) EUV machines remain the most advanced global chipmaking tools. Intel reported it is already mass-producing with these new machines, and Samsung Electronics aims to adopt them starting in 2028. TSMC plans to begin using ASML's most advanced tool from 2030. The joint initiative includes a plan to launch a pilot line for the 12-inch masks by 2031. Both parties expect full production of advanced nodes ready by 2033.